| Product | Topology | Package | BV[V] | IF[A] @25°C | VF[V] @25°C | MAIN CHIP TECHNOLOGY |
HEIGHT IN MM |
ISOLATION | SIMULATION | Datasheet | 样品申请 |
|---|
| Product | Topology | Package | BV[V] | Ids [A] /Rdson[mΩ] @25°C |
Vgs(th) [V]@25°C | Vgs(op) Type |
MAIN CHIP TECHNOLOGY |
HEIGHT IN MM |
ISOLATION | SIMULATION | Datasheet | 样品申请 |
|---|
| Product | Topology | Package | BV[V] | Ids [A] /Rdson[mΩ] @25°C |
Vgs(th) [V]@25°C | Vgs(op) Type |
MAIN CHIP TECHNOLOGY |
HEIGHT IN MM |
ISOLATION | SIMULATION | Datasheet | 样品申请 |
|---|
| Product | Topology | Package | BV[V] | Ids [A] /Rdson[mΩ] @25°C |
Vgs(th) [V]@25°C | Vgs(op) Type |
MAIN CHIP TECHNOLOGY |
HEIGHT IN MM |
ISOLATION | SIMULATION | Datasheet | 样品申请 |
|---|
| Product | Topology | Package | BV[V] | Ids [A] /Rdson[mΩ] @25°C |
Vgs(th) [V]@25°C | Vgs(op) Type |
MAIN CHIP TECHNOLOGY |
HEIGHT IN MM |
ISOLATION | SIMULATION | Datasheet | 样品申请 |
|---|